Description: Discover Hyperion Technologies, a U.S. post-fab foundry specializing in high-density interconnect advanced semiconductor packaging.
Hyperion Technologies is a post-fab, system level manufacturing foundry. Hyperion specializes in high-density interconnect semiconductor substrates, semiconductor Interconnect Fabrics™ , and microelectronic system level design and integration. Our innovative fabrication approach addresses critical technology and supply chain challenges in the semiconductor industry. With deep domain expertise, state-of-the-art, fully automated fabrication, and novel materials and processes, we are scaling microelectronic
Hyperion is breaking ground on a new U.S-based, fully-automated, semiconductor volume fabrication facility. Located in the heart of the Arizona semiconductor innovation cluster, the facility will produce high density interconnect substrates and chiplets Interconnect Fabrics™ . This pivotal project will bolster the U.S semiconductor industry’s resilience and our nation’s economic and national security.
We offer semiconductor interconnect solutions to a wide array of market segments including: